View PESD5V0S1UJ_5007872.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

PESD5V0S1UJ; PESD12VS1UJ
Unidirectional ESD protection for transient voltage suppression
Rev. 01 -- 3 June 2009 Product data sheet
1. Product profile
1.1 General description
Unidirectional ElectroStatic Discharge (ESD) protection diodes in a very small Surface-Mounted Device (SMD) plastic package designed to protect one signal line from the damage caused by ESD and transient overvoltage.
Table 1. Product overview Package NXP PESD5V0S1UJ PESD12VS1UJ SOD323F JEITA SC-90 single Configuration
Type number
1.2 Features
I Transient Voltage Suppression (TVS) protection of one line I Max. peak pulse power: PPP = 890 W I Low clamping voltage: VCL = 19 V I Low leakage current: IRM = 300 nA I ESD protection up to 30 kV I IEC 61000-4-2; level 4 (ESD) I IEC 61000-4-5 (surge); IPP = 47 A I AEC-Q101 qualified
1.3 Applications
I Computers and peripherals I Audio and video equipment I Cellular handsets and accessories I Communication systems I Portable electronics I Medical and industrial equipment
1.4 Quick reference data
Table 2. Quick reference data Tamb = 25 C unless otherwise specified. Symbol VRWM Parameter reverse standoff voltage PESD5V0S1UJ PESD12VS1UJ Cd diode capacitance PESD5V0S1UJ PESD12VS1UJ f = 1 MHz; VR = 0 V 480 160 530 180 pF pF 5 12 V V Conditions Min Typ Max Unit
NXP Semiconductors
PESD5V0S1UJ; PESD12VS1UJ
Unidirectional ESD protection for transient voltage suppression
2. Pinning information
Table 3. Pin 1 2 Pinning Description cathode anode
[1]
Simplified outline
1 2
Graphic symbol
1
2
006aaa152
[1]
The marking bar indicates the cathode.
3. Ordering information
Table 4. Ordering information Package Name PESD5V0S1UJ PESD12VS1UJ SC-90 Description plastic surface-mounted package; 2 leads Version SOD323F Type number
4. Marking
Table 5. Marking codes Marking code 1Q 1R Type number PESD5V0S1UJ PESD12VS1UJ
5. Limiting values
Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol PPP Parameter peak pulse power PESD5V0S1UJ PESD12VS1UJ IPP peak pulse current PESD5V0S1UJ PESD12VS1UJ tp = 8/20 s
[1][2]
Conditions tp = 8/20 s
[1][2]
Min -
Max 890 600 47 22.5
Unit W W A A
PESD5V0S1UJ_PESD12VS1UJ_1
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 -- 3 June 2009
2 of 14
NXP Semiconductors
PESD5V0S1UJ; PESD12VS1UJ
Unidirectional ESD protection for transient voltage suppression
Table 6. Limiting values ...continued In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Ptot Tj Tamb Tstg
[1] [2] [3] [4]
Parameter total power dissipation junction temperature ambient temperature storage temperature
Conditions Tamb 25 C
[3] [4]
Min -55 -65
Max 420 720 150 +150 +150
Unit mW mW C C C
Non-repetitive current pulse 8/20 s exponential decay waveform according to IEC 61000-4-5. Soldering point of cathode tab. Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
Table 7. ESD maximum ratings Tamb = 25 C unless otherwise specified. Symbol VESD Parameter electrostatic discharge voltage Conditions IEC 61000-4-2 (contact discharge) machine model MIL-STD-883 (human body model)
[1] Device stressed with ten non-repetitive ESD pulses.
[1]
Min -
Max 30 400 16
Unit kV V kV
Table 8. Standard
ESD standards compliance Conditions > 15 kV (air); > 8 kV (contact) > 4 kV
IEC 61000-4-2; level 4 (ESD) MIL-STD-883; class 3 (human body model)
PESD5V0S1UJ_PESD12VS1UJ_1
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 -- 3 June 2009
3 of 14
NXP Semiconductors
PESD5V0S1UJ; PESD12VS1UJ
Unidirectional ESD protection for transient voltage suppression
001aaa631
120 IPP (%) 80 100 % IPP; 8 s
001aaa630
IPP 100 % 90 %
e-t 50 % IPP; 20 s
40
10 % tr = 0.7 ns to 1 ns 0 10 20 30 t (s) 40 30 ns 60 ns t
0
Fig 1.
8/20 s pulse waveform according to IEC 61000-4-5
Fig 2.
ESD pulse waveform according to IEC 61000-4-2
6. Thermal characteristics
Table 9. Symbol Rth(j-a) Rth(j-sp)
[1] [2] [3]
Thermal characteristics Parameter thermal resistance from junction to ambient thermal resistance from junction to solder point Conditions in free air
[1] [2] [3]
Min -
Typ -
Max 290 170 35
Unit K/W K/W K/W
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. Soldering point of cathode tab.
PESD5V0S1UJ_PESD12VS1UJ_1
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 -- 3 June 2009
4 of 14
NXP Semiconductors
PESD5V0S1UJ; PESD12VS1UJ
Unidirectional ESD protection for transient voltage suppression
7. Characteristics
Table 10. Characteristics Tamb = 25 C unless otherwise specified. Symbol VRWM Parameter reverse standoff voltage PESD5V0S1UJ PESD12VS1UJ IRM reverse leakage current PESD5V0S1UJ PESD12VS1UJ VBR breakdown voltage PESD5V0S1UJ PESD12VS1UJ Cd diode capacitance PESD5V0S1UJ PESD12VS1UJ VCL clamping voltage PESD5V0S1UJ IPP = 47 A IPP = 25 A IPP = 5 A PESD12VS1UJ IPP = 22.5 A IPP = 15 A IPP = 5 A rdif differential resistance PESD5V0S1UJ PESD12VS1UJ
[1]
[1]
Conditions
Min -
Typ 0.3 <1 6.8 14.5
Max 5 12 4 100 7.3 15.75
Unit V V A nA V V
VRWM = 5 V VRWM = 12 V IR = 5 mA
6.2 13.3
f = 1 MHz; VR = 0 V 480 160 2 5 530 180 19 13.5 9.8 27 23.5 19 100 100 pF pF V V V V V V
IR = 5 mA
Non-repetitive current pulse 8/20 s exponential decay waveform according to IEC 61000-4-5.
PESD5V0S1UJ_PESD12VS1UJ_1
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 -- 3 June 2009
5 of 14
NXP Semiconductors
PESD5V0S1UJ; PESD12VS1UJ
Unidirectional ESD protection for transient voltage suppression
104 PPP (W) 103
(1)
006aab414
1.2 PPP PPP(25C) 0.8
001aaa193
(2)
102
0.4
101 101
102
103 tp (s)
104
0 0 50 100 150 Tj (C) 200
Tamb = 25 C (1) PESD5V0S1UJ (2) PESD12VS1UJ
Fig 3.
Peak pulse power as a function of exponential pulse duration; typical values
Fig 4.
Relative variation of peak pulse power as a function of junction temperature; typical values
006aab416
(1)
500 Cd (pF) 400
006aab415
103 IRM (nA) 102
300 10
(1) (2)
200
1 100
(2)
0 0 4 8 VR (V) 12
10-1 -75
-25
25
75
125 175 Tamb (C)
f = 1 MHz; Tamb = 25 C (1) PESD5V0S1UJ (2) PESD12VS1UJ
(1) PESD5V0S1UJ (2) PESD12VS1UJ
Fig 5.
Diode capacitance as a function of reverse voltage; typical values
Fig 6.
Reverse leakage current as a function of ambient temperature; typical values
PESD5V0S1UJ_PESD12VS1UJ_1
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 -- 3 June 2009
6 of 14
NXP Semiconductors
PESD5V0S1UJ; PESD12VS1UJ
Unidirectional ESD protection for transient voltage suppression
I
-VCL -VBR -VRWM -IRM -IR - P-N
V
+
-IPP
006aaa407
Fig 7.
V-I characteristics for a unidirectional ESD protection diode
PESD5V0S1UJ_PESD12VS1UJ_1
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 -- 3 June 2009
7 of 14
NXP Semiconductors
PESD5V0S1UJ; PESD12VS1UJ
Unidirectional ESD protection for transient voltage suppression
ESD TESTER acc. to IEC 61000-4-2 CZ = 150 pF; RZ = 330
RZ 450
4 GHz DIGITAL OSCILLOSCOPE
RG 223/U 50 coax
10x ATTENUATOR
50
CZ
DUT (DEVICE UNDER TEST)
vertical scale = 10 A/div horizontal scale = 15 ns/div
vertical scale = 10 V/div horizontal scale = 10 ns/div PESD12VS1UJ
GND
PESD5V0S1UJ
unclamped +8 kV ESD pulse waveform (IEC 61000-4-2 network)
clamped +8 kV ESD pulse waveform (IEC 61000-4-2 network)
vertical scale = 10 A/div horizontal scale = 15 ns/div GND
vertical scale = 10 V/div horizontal scale = 10 ns/div
PESD12VS1UJ
PESD5V0S1UJ
unclamped -8 kV ESD pulse waveform (IEC 61000-4-2 network)
clamped -8 kV ESD pulse waveform (IEC 61000-4-2 network)
006aab532
Fig 8.
ESD clamping test setup and waveforms
PESD5V0S1UJ_PESD12VS1UJ_1
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 -- 3 June 2009
8 of 14
NXP Semiconductors
PESD5V0S1UJ; PESD12VS1UJ
Unidirectional ESD protection for transient voltage suppression
8. Application information
PESD5V0S1UJ and PESD12VS1UJ are designed for the protection of one unidirectional data or signal line from the damage caused by ESD and transient overvoltage. The devices may be used on lines where the signal polarities are either positive or negative with respect to ground. The PESD5V0S1UJ provides a surge capability of 890 W and the PESD12VS1UJ provides a surge capability of 600 W per line for an 8/20 s waveform.
line to be protected (positive signal polarity)
line to be protected (negative signal polarity)
DUT
DUT
GND
GND
unidirectional protection of one line
006aab251
Fig 9.
Application diagram
Circuit board layout and protection device placement Circuit board layout is critical for the suppression of ESD and Electrical Fast Transient (EFT). The following guidelines are recommended: 1. Place the device as close to the input terminal or connector as possible. 2. The path length between the device and the protected line should be minimized. 3. Keep parallel signal paths to a minimum. 4. Avoid running protected conductors in parallel with unprotected conductors. 5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and ground loops. 6. Minimize the length of the transient return path to ground. 7. Avoid using shared transient return paths to a common ground point. 8. Ground planes should be used whenever possible. For multilayer PCBs, use ground vias.
PESD5V0S1UJ_PESD12VS1UJ_1
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 -- 3 June 2009
9 of 14
NXP Semiconductors
PESD5V0S1UJ; PESD12VS1UJ
Unidirectional ESD protection for transient voltage suppression
9. Test information
9.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications.
10. Package outline
1.35 1.15 1 0.5 0.3 0.80 0.65
2.7 2.3
1.8 1.6
2 0.40 0.25 Dimensions in mm 0.25 0.10 04-09-13
Fig 10. Package outline PESDxS1UJ (SOD323F/SC-90)
11. Packing information
Table 11. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package Description 4 mm pitch, 8 mm tape and reel Packing quantity 3000 PESD5V0S1UJ SOD323F PESD12VS1UJ
[1] For further information and the availability of packing methods, see Section 15.
10000 -135
-115
PESD5V0S1UJ_PESD12VS1UJ_1
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 -- 3 June 2009
10 of 14
NXP Semiconductors
PESD5V0S1UJ; PESD12VS1UJ
Unidirectional ESD protection for transient voltage suppression
12. Soldering
3.05 2.2 2.1 solder lands solder resist 1.65 0.95 0.5 (2x) 0.6 (2x) solder paste occupied area 0.5 (2x) 0.6 (2x) Dimensions in mm
sod323f_fr
Fig 11. Reflow soldering footprint PESDxS1UJ (SOD323F/SC-90)
PESD5V0S1UJ_PESD12VS1UJ_1
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 -- 3 June 2009
11 of 14
NXP Semiconductors
PESD5V0S1UJ; PESD12VS1UJ
Unidirectional ESD protection for transient voltage suppression
13. Revision history
Table 12. Revision history Release date 20090603 Data sheet status Product data sheet Change notice Supersedes Document ID PESD5V0S1UJ_PESD12VS1UJ_1
PESD5V0S1UJ_PESD12VS1UJ_1
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 -- 3 June 2009
12 of 14
NXP Semiconductors
PESD5V0S1UJ; PESD12VS1UJ
Unidirectional ESD protection for transient voltage suppression
14. Legal information
14.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
14.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data -- The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.
14.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental
14.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
15. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
PESD5V0S1UJ_PESD12VS1UJ_1
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 -- 3 June 2009
13 of 14
NXP Semiconductors
PESD5V0S1UJ; PESD12VS1UJ
Unidirectional ESD protection for transient voltage suppression
16. Contents
1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 9.1 10 11 12 13 14 14.1 14.2 14.3 14.4 15 16 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics. . . . . . . . . . . . . . . . . . . 4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Application information. . . . . . . . . . . . . . . . . . . 9 Test information . . . . . . . . . . . . . . . . . . . . . . . . 10 Quality information . . . . . . . . . . . . . . . . . . . . . 10 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 Packing information. . . . . . . . . . . . . . . . . . . . . 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 13 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Contact information. . . . . . . . . . . . . . . . . . . . . 13 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 3 June 2009 Document identifier: PESD5V0S1UJ_PESD12VS1UJ_1

▲Up To Search▲

Price & Availability of PESD5V0S1UJ

	To Download PESD5V0S1UJ Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .